Solder fluxes



United States Patent Ofilice 3,199,190 Patented Aug. 10, 1965 3,199,190 SOLDER FLUKE?) Harry B. Laudenslager, In, lamestown, N.Y., assignor to Blackstone Corporation, a corporation of New York No Drawing. Original application June 25, 1959, Ser.

No. 822,754, now Patent No. 3,099,590, dated July 30, 1963. Divided and this application (let. 22, 1962, Ser. No. 232,255

3 Qlaims. (Cl. 29-495) This application is a division of my application Serial 'No. 822,754, filed June 25, 1959, now US. Patent No.

3,099,590, for solder fluxes.

This invention relates to solder fluxes and, particularly, to a solder flux for soft solders and the like. There are a great many soldering applications which require a solder flux having the ability to flow into restricted areas (commonly called capillarity) and to cause solder to flow into the same restricted areas with good setting and bonding properties. Among such applications are the forming of tubing for automotive radiator cores and the making of cans and the like. A soldering flux to be satisfactory for such applicatioins must be readily washed away after soldering has been completed. It must inhibit oxide formation while in place on the material being soldered. It must be non-toxic, produce a minimum of corrosive products, have good fiuxing properties over a wide range of temperatures and have a good spread value. Heretotore, acid chloride fluxes have been generally used in such applications. These usual chloride fluxes require large amounts of cleaning equipment, steam, hot water and time in order to assure complete removal of the fluxes after soldering has been completed. Great difliculty has been experienced in the past by the residue from such fluxes corroding the metal surfaces and attacking and destroying paint coatings applied thereto aft-er the usual cleaning operation. As a result, the chloride fluxes heretofore used have been expensive to handle and remove after the soldering operation was complete and, even after painstaking cleaning operations there was no assurance that the fluxes had been entirely removed.

I have discovered a soldering flux composition which eliminates all of the difliculties characteristic of the chloride fluxes heretofore used. I have discovered a flux composition which is readily soluble in water, has excellent spread characteristics, and is easily removed after completion of the soldering operation. The residue from my flux composition, remaining after the soldering operation, is readily soluble, has very little corrosive action, is nontoxic, easy to handle and non-hygroscopic. In addition, the flux of my invention has very high capillarity and causes the solder to flow into a joint being soldered much more rapidly and smoothly than is the case with the ordinary chloride fluxes of which zinc chloride flux is representative.

I have discovered a soldering flux composed of the reaction product of an organic amine with hydroxyacetic acid, either alone or admixed with a water soluble organic acid having less than 810 carbon atoms in the chain, ammonium chloride and a wetting agent, preferably, in an aqueous solution.

Preferably, the flux of my invention contains from about 1% to about 15% of the reaction product of an organic amine and hydroxyacetic acid. When ammonium chloride is present I prefer to have from about 1% to 6% ammonium chloride, about 3% to about 12% of a water soluble organic acid having less than 8-10 carbon atoms and about 0.1% to 0.5% wetting agent. However, I may use up to 16% ammonium chloride, about 1% to 25% of the water soluble organic acid and about 0.1% to 0.8% of a wetting agent with satisfactory results.

Preferably, the reaction product of the organic amine and hydroxyacetic acid is formed by reacting one mol of amine with one mol of hydroxyacetic acid.

The invention will perhaps be better understood by referring to the following examples:

EXAMPLE I A reaction product of monoethanolamine and hydroxyacetic acid was prepared by slowly adding one mol' of hydroxyacetic acid to one mol of monoethanolamine in an ice bath. The material was held at a temperature below 55 C. and was agitated slowly. A reaction product in the form of water soluble crystals was recovered. These crystals had a melting point of about 186190 R, a boiling point of about 315335 F., and a decomposition temperature of about 575:10" F. 0n analysis the crystals showed 9.58% nitrogen and 33.05% carbon. About 104 Btu. of heat per lb. of reaction product was produced by the reaction.

This reaction product was added to water containing 0.4% Compound M wetting agent. (Johnson March Co. of Philadelphia brand of polyether alcohols of varying chain lengths) and was tested for spread by the ASTM Spread Test Special Publication 189 with the following results.

Amt. of reaction of product in sol. Spread value Similar tests for comparison purposes were made using zinc chloride in water containing 0.4% wetting agent with the following values.

Spread, percent 14 Baum zinc chloride sol. (about 12% sol.) 91.2

15 Baum zinc chloride sol. (about 13% sol.) 90.6

EXAMPLE II One percent of the reaction product of Example I was mixed in aqueous solution with 3.5% of hydroxyacetic acid and 4% ammonium chloride and spread tests were made. The spread value was 91.5%.

EXAMPLE HI Similarly, two percent of the reaction product of Example I was mixed in aqueou solution with 3.5% hydroxyacetic acid and 4% ammonium chloride. The spread test value was 90.8%.

EXAMPLE IV The reaction product of Example I was formed into a paste flux by combining with Tergitol XD (an alkyl polyalkylene glycol) and petroleum jelly with excellent results. ,It was found that in such paste fluxes the amount of reaction product must not exceed 50%.

The reaction products of other organic amines were similarly prepared and spread tests made. These values appear hereinafter in Table I.

Table 1 Percent spread, Percent spread, 1% of pure reaction 2% of pure reaction product in 3.5% product in 3.5% HoHAc 4% HoHAc 4% NH4C1 NH4C1 N Butylamine Monoisopropauolamine Diethylethanolomme Di-N-Butylamine N-aminopropylmorpholine 1 Triethylene tetramine.- Tetraethylenepentamine Diisopropanolamine Lon- The reaction product is preferably used in aqueous solution but may be used in alcohol provided there is at least 1% of Water present to dissolve the reaction product.- Alcoholis a useful carrier Where the flux is to be Various wetting agents such as Tergitol EH, Tergitol 3;,

#4 (higher sodium alkyl sulfates produced by Carbide and Carbon Chemicals 00.), Compound M, previously mentioned, Duponol' 80 and others may be used with the flux of this'invention. I 1

While I have illustrated and described certain present 5 preferred embodiments of my invention, it will be understood that this invention may be otherwise embodied within the scope of the following claims.

I claim: a

1. The method of soldering which comprises applying to the surfaces to be soldered a solder flux consisting essentially of the reaction product of an organic amine with hydroxyacetic acid, heating said surfaces to soldering temperature and applying a solder composition to the heated surfaces. 7

2. The method-of soldering which comprises applying to the surfaces to be soldered a solder flux consisting essentially of the reaction product of one mol of organic amine with one moi of h'ydroxyacetic acid, heating said product and surface and applying a solder composition to the heated surfaces. 7 V

3. The method of soldering which comprises applying to the surfaces to be soldered a solder flux consisting essentially of an effective amount to about 50% of the re action product of an organic amine with hydroxyacetic acid suspended in. a mixture of petroleum jelly and a Wetting agent to make a total of 100%, heating said surfaces and product and applying a solder composition thereto.

t References Cited by the Examiner V UNITED STATES PATENTS r 2,756,497 7/56 Gale -1 14s 23 2,868,833 1/59 Szabo et al. 260561 DAVID L. RECK, Primary Examiner.

v WINSTON A. DOUGLAS, Examiner. 

1. THE METHOD OF SOLDERING WHICH COMPRISES APPLYING TO THE SURFACES TO BE SOLDERED A SOLDER FLUX CONSISTING ESSENTIALLY OF THE REACTION PRODUCT OF AN ORGANIC AMINE WITH HYDROXYACETIC ACID, HEATING SAID SURFACES TO SOLDERING TEMPERATURE AND APPLYING A SOLDER COMPOSITION TO THE HEATED SURFACES. 